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EXAMPLE STENCIL DESIGN

16X (1.5)

16X (0.45)

14X (0.65)

(5.8)

(R0.05) TYP

(3.55)

BASED ON

0.125 THICK

STENCIL

(2.46)

BASED ON

0.125 THICK

STENCIL

PowerPAD TSSOP - 1.2 mm max height

PWP0016J

SMALL OUTLINE PACKAGE

4223595/A 03/2017

2.08 X 3.00

0.175

2.25 X 3.24

0.15

2.46 X 3.55 (SHOWN)

0.125

2.75 X 3.97

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

NOTES: (continued)

10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

11. Board assembly site may have different recommendations for stencil design.

TM

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE: 10X

SYMM

SYMM

1

8

9

16

METAL COVERED

BY SOLDER MASK

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES