L9613

Package information

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4

Package information

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®

packages. ECOPACK® packages are lead-free. The category of second Level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to soldering conditions are also marked on the inner

box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 12. SO8 mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

1.750

0.0689

A1

0.100

0.250 0.0039

0.0098

A2

1.250

0.0492

b

0.280

0.480 0.0110

0.0189

c

0.170

0.230 0.0067

0.0091

D (1)

4.800

4.900

5.000 0.1890 0.1929 0.1969

E

5.800

6.000

6.200 0.2283 0.2362 0.2441

E1(2)

3.800

3.900

4.000 0.1496 0.1535 0.1575

e

1.270

0.0500

h

0.250

0.500 0.0098

0.0197

L

0.400

1.270 0.0157

0.0500

L1

1.040

0.0409

k

0˚8˚

0˚8˚

ccc

0.100

0.0039

Notes: 1. Dimensions D does not include mold flash,

protrusions or gate burrs.

Mold flash, potrusions or gate burrs shall not

exceed 0.15mm in total (both side).

2. Dimension “E1” does not include interlead flash

or protrusions. Interlead flash or protrusions shall

not exceed 0.25mm per side.

SO-8

0016023 D