CLP270M datasheet(16/24 Pages) STMICROELECTRONICS

16 / 24 page

CLP270M

16/24

Symbol

Parameter

Test Conditions

Value

Unit

IPP

Line to GND peak surge

current

10/1000

µs (open circuit voltage

wave shape 10/1000

µs)

100

5/310

µs (open circuit voltage

wave shape 10/700

µs)

150

2/10

µs (open circuit voltage

wave shape)

500

ITSM

Non repetitive surge peak

on-state current (TIP or

RING versus Ground)

F=50Hz

tp=20ms

tp = 200 ms

tp=2s

Tstg

Storage temperature range

Maximum junction temperature

-40to + 150

150

°C

Maximum lead temperature for soldering during 10 s

260

°C

ABSOLUTE MAXIMUM RATINGS (RSENSE =4

Ω, and Tamb =25°C)

Symbol

Parameter

Test Conditions

Value

Unit

Min.

Typ.

Max.

ILGL

Line to GND leakage

current

. VLG = 240 V

. Measured between TIP

(or RING) and GND

µA

Vref

Overvoltage internal

reference

. ILG =1mA

. Measured between TIP

(or RING) and GND

265

VSWON

Line to GND voltage at

SW1 or SW2 switching-on

. Measured at 50 Hz between

TIPL (or RINGL) and GND

400

ISWOFF

Line to GND current at

SW1 or SW2 switching-off

(negative current)

. Refer to test circuit page 17

150

ISWON

Line current at SW1 or

SW2 switching-on

. Positive pulse

. Negative pulse

150

190

280

320

RING to GND capacitance

TIP to GND capacitance

TIP to RING capacitance

. VRINGL =-1V

. VTIPL = -48 V

.VGND =0V

. F = 1 MHz VRMS =1V

180

ELECTRICAL CHARACTERISTICS (RSENSE =4

Ω, and Tamb = 25°C)

CLP270M 数据表(PDF) 16 Page - STMicroelectronics

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