CLP270M datasheet(20/24 Pages) STMICROELECTRONICS

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CLP270M

20/24

Fig 36 : Typical reflow soldering heat profile

Time (s)

Temperature ( C)

120

160

200

240

280

320

360

100

150

200

250

215 C

Soldering

Preheating

Cooling

245 C

Epoxy FR4

board

Metal-backed

board

SOLDERING RECOMMENDATION

The

soldering

process

causes

considerable

thermal stress to a semiconductor component.

This has to be minimized to assure a reliable and

extended

lifetime

the

device.

The

PowerSO-10

TM package can be exposed to a

maximum temperature of 260°C for 10 seconds.

However a proper soldering of the package could

be done at 215°C for 3 seconds. Any solder

temperature profile should be within these limits.

As reflow techniques are most common in surface

mounting, typical heating profiles are given in

Figure 36, either for mounting on FR4 or on

metal-backed boards. For each particular board,

the appropriate heat profile has to be adjusted

experimentally. The present proposal is just a

starting

point.

any

case,

the

following

precautions have to be considered :

- always preheat the device

- peak temperature should be at least 30 °C

higher than the melting point of the solder

alloy chosen

- thermal capacity of the base substrate

Voids pose a difficult reliability problem for large

surface mount devices. Such voids under the

package result in poor thermal contact and the

high thermal resistance leads to component

failures. The PowerSO-10 is designed from

scratch to be solely a surface mount package,

hence symmetry in the x- and y-axis gives the

package excellent weight balance. Moreover, the

PowerSO-10 offers the unique possibility to control

easily the flatness and quality of the soldering

process. Both the top and the bottom soldered

edges of the package are accessible for visual

inspection (soldering meniscus).

Coplanarity

between

the

substrate

and

the

package can be easily verified. The quality of the

solder joints is very important for two reasons : (I)

poor quality solder joints result directly in poor

reliability

and (II) solder thickness affects the

thermal resistance significantly. Thus a tight

control of this parameter results in thermally

efficient and reliable solder joints.

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