9 Device and Documentation Support

9.1 Documentation Support

9.1.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, DS123x 2- and 4-Channel, 24-Bit, Delta-Sigma ADCs for Bridge Sensors, data sheet

• Texas Instruments, Digital Isolator Design Guide, application note

• Texas Instruments, Isolation Glossary, application note

• Texas Instruments, MSP430G2x32, MSP430G2x02 Mixed Signal Microcontrollers, data sheet

• Texas Instruments, Transformer Driver for Isolated Power Supplies, data sheet

9.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 9-1. Related Links

PARTS

PRODUCT FOLDER

ORDER NOW

TECHNICAL

DOCUMENTS

TOOLS &

SOFTWARE

SUPPORT &

COMMUNITY

ISO7840

Click here

Click here

Click here

Click here

Click here

ISO7840F

Click here

Click here

Click here

Click here

Click here

9.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

9.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.5 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

9.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (April 2016) to Revision C (July 2025)

Page

• Added 15mm typical specification for CLR/CPG in Insulation Specification ..................................................... 6

ISO7840, ISO7840F

SLLSEN2C – JULY 2015 – REVISED JULY 2025

www.ti.com

24

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