5.4 Thermal Information

ISO7840

UNIT

THERMAL METRIC(1)

DW (SOIC)

DWW (SOIC)

16 Pins

16 Pins

RθJA

Junction-to-ambient thermal resistance

78.9

78.9

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

41.6

41.1

°C/W

RθJB

Junction-to-board thermal resistance

43.6

49.5

°C/W

ψJT

Junction-to-top characterization parameter

15.5

15.2

°C/W

ψJB

Junction-to-board characterization parameter

43.1

48.8

°C/W

RθJC(bottom) Junction-to-case(bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.5 Power Ratings

VCC1 = VCC2 = 5.5V, TJ = 150°C, CL = 15pF, input a 50MHz 50% duty cycle square wave

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

PD

Maximum power dissipation by ISO7840x

200

mW

PD1

Maximum power dissipation by side-1 of

ISO7840x

40

mW

PD2

Maximum power dissipation by side-2 of

ISO7840x

160

mW

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ISO7840, ISO7840F

SLLSEN2C – JULY 2015 – REVISED JULY 2025

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