in certain cases. Techniques such as inserting grooves, ribs, or both on a printed circuit board are used to help increase these

specifications.

(2)

This coupler is suitable for safe electrical insulation only within the safety ratings. Compliance with the safety ratings shall be ensured

by means of suitable protective circuits.

(3)

Testing is carried out in air to determine the surge immunity of the package.

(4)

Testing is carried out in oil to determine the intrinsic surge immunity of the isolation barrier.

(5)

Apparent charge is electrical discharge caused by a partial discharge (pd).

(6)

All pins on each side of the barrier tied together creating a two-terminal device.

5.7 Safety-Related Certifications

VDE

CSA

UL

CQC

TUV

Certified according to DIN

EN IEC 60747-17 (VDE

0884-17)

Certified according to IEC

62368-1 and IEC 60601-1

Certified according to

UL 1577 Component

Recognition Program

Certified according to GB

4943.1

Certified according to EN 61010-1 and

EN 62368-1

Certificate number:

40040142

Master contract number:

220991

File number: E181974

Certificate number:

CQC15001121716

Client ID number: 77311

5.8 Safety Limiting Values

Safety limiting intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure

of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat

the die and damage the isolation barrier potentially leading to secondary system failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

IS

Safety input, output, or supply

current

RθJA = 78.9°C/W, VI = 5.5V, TJ = 150°C, TA = 25°C

288

mA

RθJA = 78.9°C/W, VI = 3.6V, TJ = 150°C, TA = 25°C

440

RθJA = 78.9°C/W, VI = 2.75V, TJ = 150°C, TA = 25°C

576

PS

Safety input, output, or total

power

RθJA = 78.9°C/W, TJ = 150°C, TA = 25°C

1584

mW

TS

Maximum safety temperature

150

°C

The maximum safety temperature is the maximum junction temperature specified for the device. The power

dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines

the junction temperature. The assumed junction-to-air thermal resistance in the Section 5.4 is that of a device

installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum

input voltage times the current. The junction temperature is then the ambient temperature plus the power times

the junction-to-air thermal resistance.

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ISO7840, ISO7840F

SLLSEN2C – JULY 2015 – REVISED JULY 2025

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