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LP55231 数据表(PDF) 2 Page - Texas Instruments |
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LP55231 数据表(HTML) 2 Page - Texas Instruments |
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2 / 59 page ![]() 2 LP55231 SNOSCR5D – MARCH 2013 – REVISED DECEMBER 2016 www.ti.com Product Folder Links: LP55231 Submit Documentation Feedback Copyright © 2013–2016, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 4 6.1 Absolute Maximum Ratings ...................................... 4 6.2 ESD Ratings.............................................................. 4 6.3 Recommended Operating Conditions ....................... 4 6.4 Thermal Information .................................................. 4 6.5 Electrical Characteristics........................................... 5 6.6 Charge Pump Electrical Characteristics ................... 5 6.7 LED Driver Electrical Characteristics ........................ 6 6.8 LED Test Electrical Characteristics........................... 6 6.9 Logic Interface Characteristics.................................. 6 6.10 Recommended External Clock Source Conditions . 7 6.11 Serial Bus Timing Parameters (SDA, SCL) ............ 7 6.12 Typical Characteristics ............................................ 8 7 Detailed Description ............................................ 10 7.1 Overview ................................................................. 10 7.2 Functional Block Diagram ....................................... 10 7.3 Feature Description................................................. 11 7.4 Device Functional Modes........................................ 17 7.5 Programming........................................................... 18 7.6 Register Maps ......................................................... 20 8 Application and Implementation ........................ 46 8.1 Application Information............................................ 46 8.2 Typical Applications ................................................ 46 9 Power Supply Recommendations ...................... 50 10 Layout................................................................... 50 10.1 Layout Guidelines ................................................. 50 10.2 Layout Example .................................................... 50 11 Device and Documentation Support ................. 51 11.1 Device Support...................................................... 51 11.2 Trademarks ........................................................... 51 11.3 Receiving Notification of Documentation Updates 51 11.4 Community Resources.......................................... 51 11.5 Electrostatic Discharge Caution ............................ 51 11.6 Glossary ................................................................ 51 12 Mechanical, Packaging, and Orderable Information ........................................................... 51 4 Revision History Changes from Revision C (November 2016) to Revision D Page • Added top nav icon for TI Designs ........................................................................................................................................ 1 • Changed variable 1 spanning to go from Bit [3] to Bit [2] and variable 2 span from Bit [1] to Bit [0] in table 7 .................. 39 Changes from Revision B (May 2016) to Revision C Page • Changed wording of data sheet title....................................................................................................................................... 1 Changes from Revision A (October 2014) to Revision B Page • Added several new Applications ............................................................................................................................................ 1 • Changed Handling Ratings to ESD Ratings; moved storage temperature to Abs Max table ............................................... 4 • Changed RθJA value from 36.6C/W to 33.3C/W; add additional thermal information ............................................................. 4 • Added Community Resources section ................................................................................................................................ 51 Changes from Original (March 2013) to Revision A Page • Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section ............. 1 |
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