L99MC6 datasheet(48/55 Pages) STMICROELECTRONICS

48 / 55 page

Package and PCB thermal data

L99MC6

48/32

Doc ID 16523 Rev 2

Package and PCB thermal data

12.1

PowerSSO-16 thermal data

Figure 22.

PowerSSO-16 PC board(1)

Layout condition of thermal resistance measurements (PCB: double layer, thermal vias,

FR4 area = 77 mm x 86 mm, PCB thickness =1.6 mm, Cu thickness = 70 µm (front and back side) thermal

vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 25 µm,

footprint dimension 2.5 mm x 4.2 mm ).

Table 46.

Auto and mutual thermal resistance - footprint

HSD 1

HSD 2

HSD 3

LSD 4

LSD 5

LSD 6

HSD 1

89.57

85.83

84.41

88.89

87.06

85.84

HSD 2

85.83

89.57

84.41

87.06

88.89

87.06

HSD 3

84.41

89.57

85.84

87.06

88.89

LSD 4

88.89

87.06

85.84

93.58

90.54

89.08

LSD 5

87.06

88.89

87.06

90.54

93.58

90.54

LSD 5

85.84

87.06

88.89

89.08

90.54

93.58

Table 47.

Auto and mutual thermal resistance - 2 cm2 of Cu heatsink

HSD 1

HSD 2

HSD 3

LSD 4

LSD 5

LSD 6

HSD 1

59.96

55.06

54.23

58.25

56.08

54.71

HSD 2

55.06

59.96

54.23

56.08

58.25

56.08

HSD 3

54.23

59.96

54.71

56.08

58.25

LSD 4

58.25

56.08

54.71

61.80

60.37

59.45

LSD 5

56.08

58.25

56.08

60.37

61.80

60.37

LSD 5

54.71

56.08

58.25

59.45

60.37

61.80

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