Figure 7. Junction capacitance versus reverse voltage

applied (typical values)

1

2

5

1 0

20

50

100

10

20

50

100

200

C (pF)

V (V)

R

F=1MHz

T =25°C

j

Figure 8. Forward voltage drop versus forward current

(maximum values)

0

0.2

0.4

0.6

0.8

1

1.2

1.4

1.6

1E-2

1E-1

1E+0

1E+1

I

(A)

FM

V

(V)

FM

T =125°C

j

T =25°C

j

Figure 9. Thermal resistance junction to ambient versus

copper surface under each lead (SMB)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

SMB

S(Cu)(cm²)

Epoxy p ri nted ci rcuit board FR4, coppe r t hickness: 35 µm

Figure 10. Thermal resistance junction to ambient versus

copper surface under each lead (SMA)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

SMA

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat

Notch)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

SMA Flat Notch

STPS160

Characteristics (curves)

DS0962 - Rev 10

page 4/13