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PM8804 数据表(PDF) 25 Page - STMicroelectronics |
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PM8804 数据表(HTML) 25 Page - STMicroelectronics |
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25 / 27 page ![]() DocID031629 Rev 1 25/27 PM8804 Package information 27 Figure 15. VFQFPN 3.0x3.0x1.0 16L 0.5 mm pitch recommended footprint Note: This footprint is able to ensure insulation up to 30 Vrms (according to CEI IEC-664-1). The device must be positioned within 0.02 A B. Table 7. VFQFPN 3.0x3.0x1.0 16L 0.5 mm pitch mechanical data Symbol Dimensions (mm) Min. Nom. Max. A 0.80 0.90 1.00 A1 0.00 0.02 0.05 A3 0.20 REF. b 0.20 0.25 0.30 D 3.00 BSC D1 1.50 BSC D2 1.70 1.80 1.90 e 0.50 BSC E 3.00 BSC E1 1.50 BSC E2 1.70 1.80 1.90 L 0.30 0.40 0.50 k0.20 - - N16 6 - |
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