SAP5S / SAP51

Universal Actuator-Sensor Interface IC

Data Sheet

July 17, 2012

© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 3.1

All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without

the prior written consent of the copyright owner. The information furnished in this publication is PRELIMINARY and subject to

changes without notice.

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Contents

0

 

Read this First ............................................................................................................................................... 8

 

0.1.

  Important Notice ..................................................................................................................................... 8 

0.2.

  References ............................................................................................................................................. 8 

0.3.

  Revision History...................................................................................................................................... 8 

1

 

General Device Specification ........................................................................................................................ 9

 

1.1.

  Absolute Maximum Ratings (Non Operating)......................................................................................... 9 

1.2.

  Operating Conditions............................................................................................................................ 10 

1.3.

  EMC Behavior....................................................................................................................................... 10 

1.4.

  Quality Standards ................................................................................................................................. 10 

1.5.

  Failure Rate .......................................................................................................................................... 11 

1.6.

  Humidity Class...................................................................................................................................... 11 

1.7.

  Package Pin Assignment...................................................................................................................... 12 

2

 

Basic Functional Description ....................................................................................................................... 14

 

2.1.

  Functional Block Diagram..................................................................................................................... 14 

2.2.

  General Operational Modes ................................................................................................................. 16 

2.3.

  Slave Mode........................................................................................................................................... 16 

2.3.1.

  AS-i communication channel ......................................................................................................... 16 

2.3.2.

  Parameter Port Pins....................................................................................................................... 16 

2.3.3.

  Data Port Pins ................................................................................................................................ 17 

2.3.4.

  Data Input Inversion ....................................................................................................................... 17 

2.3.5.

  Data Input Filtering......................................................................................................................... 17 

2.3.6.

  Synchronous Data I/O Mode.......................................................................................................... 17 

2.3.7.

  4 Input / 4 Output processing in Extended Address Mode ............................................................ 17 

2.3.8.

  AS-i Safety Mode ........................................................................................................................... 18 

2.3.9.

  Enhanced LED Status Indication ................................................................................................... 18 

2.3.10.

  Communication Monitor/Watchdog................................................................................................ 18 

2.3.11.

  Write protection of ID_Code_Extension_1..................................................................................... 18 

2.3.12.

  Summary of Master Calls............................................................................................................... 19 

3

 

E²PROM ...................................................................................................................................................... 22

 

3.1.

  Overview............................................................................................................................................... 22 

3.2.

  User Area Programming....................................................................................................................... 23 

3.3.

  Firmware Area Programming ............................................................................................................... 25 

3.4.

  Safety Area Programming .................................................................................................................... 26 

4

 

Detailed Functional Description................................................................................................................... 28

 

4.1.

  Power Supply........................................................................................................................................ 28 

4.1.1.

  Voltage Output Pins UOUT and U5R............................................................................................. 28 

4.1.2.

  Input Impedance (AS-i bus load) ................................................................................................... 29 

4.2.

  Thermal Protection ............................................................................................................................... 29