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BAT30F4 数据表(PDF) 7 Page - STMicroelectronics |
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BAT30F4 数据表(HTML) 7 Page - STMicroelectronics |
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7 / 11 page ![]() 3 Recommendation on PCB assembly 3.1 Stencil opening design 1. General recommendation on stencil opening design a. Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 10. Stencil opening recommendation L T W b. General design rule ◦ Stencil thickness (T) = 75 ~ 125 μm ◦ WT≥1.5 ◦ L × W 2TL +W ≥0.66 1. Reference design a. Stencil opening thickness: 80 µm b. Other dimensions: see below figure. Figure 11. Recommended stencil window position, stencil opening thickness: 80 μm 0.230 (0.0091) 0.183 (0.0072) 0.170 (0.0067) 0.656 (0.0258) 0.643 (0.0253) Footprint Stencil window 0.007 (0.00027) 0.007 (0.00027) mm (inches) 0.243 (0.0096) BAT30F4 Recommendation on PCB assembly DS10126 - Rev 8 page 7/11 |
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