1

Characteristics

Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified)

Symbol

Parameter

Value

Unit

VRRM

Repetitive peak reverse voltage

30

V

IF

Continuous forward current

300

mA

IFSM

Surge non repetitive forward current

tp = 10 ms sinusoidal

4

A

PD(1)

Power dissipation

200

mW

Tstg

Storage temperature range

-55 to + 150

°C

TOP

Operating junction temperature range

-40 to +105

°C

Tj

Maximum junction temperature in DC forward mode

150

°C

TL

Maximum soldering temperature during 10 s

260

°C

1. On epoxy printed circuit board with minimum recommended footprint

Table 2. Thermal resistance parameter

Symbol

Parameter

Value (Typ.)

Unit

Rth(j-a)

Junction to ambient (1)

450

°C/W

1. On epoxy printed circuit board with minimum recommended footprint

Table 3. Static electrical characteristics

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

IR(1)

Reverse leakage current

Tj = 25 °C

VR = 10 V

-

2.2

6.0

µA

Tj = 85 °C

-

300

Tj = 25 °C

VR = 30 V

-

18

Tj = 85 °C

-

1600

VF(2)

Forward voltage drop

Tj = 25 °C

IF = 5 mA

-

0.285

V

Tj = 85 °C

-

0.205

Tj = 25 °C

IF = 10 mA

-

0.27

0.31

Tj = 85 °C

-

0.24

Tj = 25 °C

IF = 100 mA

-

0.39

0.44

Tj = 85 °C

-

0.40

Tj = 25 °C

IF = 300 mA

-

0.55

0.625

Tj = 85 °C

-

0.64

1. Pulse test: tp = 5 ms, δ < 2%

2. Pulse test: tp = 380 µs, δ < 2%

BAT30F4

Characteristics

DS10126 - Rev 8

page 2/11