MLX90609

Angular Rate Sensor (Standard version)

390109060901

Page 18 of 22

Data Sheet

Rev 008

February/08

7. Standard Information Regarding Manufacturability of Melexis

Products with Different Soldering Processes

Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity

level according to following test methods:

Reflow Soldering SMD’s (Surface Mount Devices)

IPC/JEDEC J-STD-020

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

(Classification reflow profiles according to table 5-2)

EIA/JEDEC JESD22-A113

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

(Reflow profiles according to table 2)

Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

EN60749-20

Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat

EIA/JEDEC JESD22-B106 and EN60749-15

Resistance to soldering temperature for through-hole mounted devices

Iron Soldering THD’s (Through Hole Devices)

EN60749-15

Resistance to soldering temperature for through-hole mounted devices

Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

EIA/JEDEC JESD22-B102 and EN60749-21

Solderability

For all soldering technologies deviating from above mentioned standard conditions (regarding peak

temperature, temperature gradient, temperature profile etc) additional classification and qualification tests

have to be agreed upon with Melexis.

The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of

adhesive strength between device and board.

8. ESD Precautions

Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).

Always observe Electro Static Discharge control procedures whenever handling semiconductor

products.