FPD2000AS datasheet(10/10 Pages) FILTRONIC

10 / 10 page

Specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Tel: +44 (0) 1325 301111

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Datasheet v3.0

FPD2000AS

PREFERRED ASSEMBLY INSTRUCTIONS:

This package is compatible with both lead free

and leaded solder reflow processes as defined

within IPC/JEDEC J-STD-020C. The maximum

package

temperature

should

not

exceed

260°C. Package leads are gold plated.

HANDLING PRECAUTIONS:

To avoid damage to

the devices care

should be exercised

during handling.

Proper Electrostatic Discharge (ESD)

precautions should be observed at all stages

of storage, handling, assembly, and testing.

ESD/MSL RATING:

These devices should be treated as Class 1A

(250-500 V) using the human body model as

defined in JEDEC Standard No. 22-A114.

Further information on ESD control measures

can be found in MIL-STD-1686 and MIL-

HDBK-263.

The device has a MSL rating of Level 1. To

determine this rating, preconditioning was

performed to the device per, the Pb-free solder

profile defined within IPC/JEDEC J-STD-020C,

Moisture / Reflow sensitivity classification for

non-hermatic solid state surface mount devices

APPLICATION NOTES & DESIGN DATA:

Application Notes and design data including S-

parameters, noise parameters and device

model are available on request.

DISCLAIMERS:

This product is not designed for use in any

space based or life sustaining/supporting

equipment.

ORDERING INFORMATION:

PART NUMBER

DESCRIPTION

FPD2000AS

Packaged pHEMT

FPD2000AS-EB

Packaged pHEMT evaluation board

EB-2000AS-AB (880MHz)

EB-2000AS-AA (1.85GHz)

EB-2000AS-AD (2.14GHz)

EB-2000AS-AE (2.4GHz)

EB-2000AS-AF (2.44GHz)

EB-2000AS-AG (2.5 to 2.7GHz)

EB-2000AS-AH (3.5GHz)

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