24LC024 datasheet(32/41 Pages) MICROCHIP

32 / 41 page

24AA024/24LC024/24AA025/24LC025

DS20001210Q-page 32

 2007-2022 Microchip Technology Inc. and its subsidiaries

Microchip Technology Drawing No. C04-129-MN Rev E Sheet 2 of 2

8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

NOM

MILLIMETERS

0.50 BSC

2.00 BSC

3.00 BSC

0.20 REF

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Contact-to-Exposed Pad

Contact Thickness

Exposed Pad Width

Exposed Pad Length

4. Dimensioning and tolerancing per ASME Y14.5M

3. Package is saw singulated

2. Package may have one or more exposed tie bars at ends.

Notes:

Contact Width

Overall Width

Overall Length

Contact Length

Standoff

Number of Pins

Overall Height

Pitch

0.20

Units

Dimension Limits

0.20

1.35

1.25

0.25

0.00

0.70

MIN

0.25

0.30

1.30

1.40

1.35

0.30

0.45

1.45

0.75

0.02

0.05

0.80

MAX

With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)

24LC024 数据表(PDF) 32 Page - Microchip Technology

24LC024 数据表(HTML) 32 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41

数据表下载