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L6205

PARALLELED OPERATION

The outputs of the L6205 can be paralleled to increase the output current capability or reduce the power dissi-

pation in the device at a given current level. It must be noted, however, that the internal wire bond connections

from the die to the power or sense pins of the package must carry current in both of the associated half bridges.

current rating is not increased since the total current must still flow through one bond wire on the power supply

or sense pin. In addition, the over current detection senses the sum of the current in the upper devices of each

bridge (A or B) so connecting the two halves of one bridge in parallel does not increase the over current detec-

tion threshold.

For most applications the recommended configuration is Half Bridge 1 of Bridge A paralleled with the Half Bridge

1 of the Bridge B, and the same for the Half Bridges 2 as shown in Figure 12. The current in the two devices

In this configuration the resulting Bridge has the following characteristics.

- Equivalent Device: FULL BRIDGE

- 5.6A max RMS Load Current

- 11.2A OCD Threshold

Figure 12. Parallel connection for higher current

To operate the device in parallel and maintain a lower over current threshold, Half Bridge 1 and the Half Bridge

2 of the Bridge A can be connected in parallel and the same done for the Bridge B as shown in Figure 13. In

this configuration, the peak current for each half bridge is still limited by the bond wires for the supply and sense

pins so the dissipation in the device will be reduced, but the peak current rating is not increased. This configu-

ration, the resulting bridge has the following characteristics.

- Equivalent Device: FULL BRIDGE

- 2.8A max RMS Load Current

- 5.6A OCD Threshold

4

7

16

15

18

13

GND

GND

GND

GND

POWER

GROUND

SIGNAL

GROUND

+

-

VS

VCP

VBOOT

17

6

5

11

14

3

12

19

LOAD

8

EN

20

D02IN1359

1

IN2

10

9

IN1

2