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Figure 18. Mounting the PowerSO package.

Figure 19. PowerSO36 Junction-Ambient thermal resistance versus on-board copper area.

Figure 20. PowerDIP24 Junction-Ambient thermal resistance versus on-board copper area.

Figure 21. SO24 Junction-Ambient thermal resistance versus on-board copper area.

Slug soldered

to PCB with

dissipating area

Slug soldered

to PCB with

dissipating area

plus ground layer

Slug soldered to PCB with

dissipating area plus ground layer

contacted through via holes

13

18

23

28

33

38

43

12

3

4

56

7

8

9

10

1 1

1 2

13

W ithout G round La yer

W ith Gr ound La yer

W ith Gr ound La yer + 16 via

Ho le s

sq . c m

ºC / W

On-Board Copper Area

39

40

41

42

43

44

45

46

47

48

49

1

2

3

4

5

6

7

8

9

101112

C o pper Are a is on Bo ttom

Sid e

C o pper Are a is on To p S i de

s q . cm

ºC / W

On-Board Copper Area

48

50

52

54

56

58

60

62

64

66

68

123

45

6789

10

11

12

C o pp er A rea is o n T op S ide

sq. cm

ºC / W

On-Board Copper Area