AD8318

Rev. B | Page 24 of 24

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VGGC

2.25

2.10 SQ

1.95

16

5

13

8

9

12

1

4

1.95 BSC

PIN 1

INDICATOR

TOP

VIEW

4.00

BSC SQ

3.75

BSC SQ

COPLANARITY

0.08

EXPOSED

PAD

(BOTTOM VIEW)

12° MAX

1.00

0.85

0.80

SEATING

PLANE

0.35

0.30

0.25

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

0.20 REF

0.65 BSC

0.60 MAX

0.60 MAX

PIN 1

INDICATOR

0.25 MIN

0.75

0.60

0.50

Figure 51. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad

(CP-16-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Ordering

Quantity

AD8318ACPZ-REEL71

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-4

1,500

AD8318ACPZ-R21

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-4

250

AD8318ACPZ-WP1, 2

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-4

64

AD8318-EVALZ1

Evaluation Board

©2004-2007 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D04853-0-

4/07(B)