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AD8139ACP-R2 数据表(PDF) 23 Page - Analog Devices |
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AD8139ACP-R2 数据表(HTML) 23 Page - Analog Devices |
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23 / 24 page ![]() AD8139 Rev. B | Page 23 of 24 Exposed Paddle (EP) Because this is a single-ended-to-differential application on a single supply, the input common-mode voltage swing must be checked. From Figure 64, β = 0.52, VOCM = 2.4 V, and VICM is 1.1 V p-p swinging about ground. Using Equation 16, VACM is calculated to be 0.53 V p-p swinging about a baseline of 1.25 V, and the minimum negative excursion is approximately 1 V. The 8-lead SOIC and the 8-lead LFCSP have an exposed paddle on the bottom of the package. To achieve the specified thermal resistance, the exposed paddle must be soldered to one of the PCB planes. The exposed paddle mounting pad should contain several thermal vias within it to ensure a low thermal path to the plane. AD8139 + – 8 2 1 6 3 4 2.4V 2V p-p RT 61.9Ω 5 VOCM 200Ω 226Ω 205Ω 205Ω 25Ω 25Ω 0.01µF 0.01µF 0.01µF AIN AIN GND C1 0.1µF C2 VREF 0.1µF AVCC DVCC 5V 3.3V AD6645 VS SIGNAL SOURCE 50Ω Figure 64. AD8139 Driving AD6645, 14-Bit, 80 MSPS/105 MSPS ADC |
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