Data Sheet

ADPA7005

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 5 of 24

Table 5.

Parameter

Rating

Drain Bias Voltage (VDDx)

6.0 V

Gate Bias Voltage (VGGx)

–1.6 to 0 V

RF Input Power (RFIN)

27 dBm

Continuous Power Dissipation (PDISS),

TCASE = 85°C (Derate 137 mW/°C Above 85°C)

12.33 W

Temperature

Storage Range

–55°C to +150°C

Operating Range

–40°C to +85°C

Maximum Channel

175°C

Quiescent Channel (TCASE = 85°C, VDD = 5 V,

IDQ = 1400 mA, Input Power (PIN) = Off)

136.1°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to system design and oper-

ating environment. Careful attention to the printed circuit board

(PCB) thermal design is required.

θJC is the channel to case thermal resistance (channel to exposed

metal paddle/pad on the underside of the device).

Table 6. Thermal Resistance

Package Type

θJC

Unit

EH-18-11

7.3

°C/W

1 θJC is determined by simulation under the following conditions: the heat

transfer is due solely to thermal conduction from the channel, through the

ground pad, to the PCB. The ground pad is held constant at the operating

temperature of 85°C.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for ADPA7005

Table 7. ADPA7005, 18-Terminal LCC_HS

ESD Model

Withstand Threshold (V)

Class

HBM

250

1A

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.