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ADPA7005AEHZ-R7 数据表(PDF) 1 Page - Analog Devices

部件名 ADPA7005AEHZ-R7
功能描述  18 GHz to 44 GHz, GaAs, pHEMT, 32 dBm (>1 W), MMIC Power Amplifier
PDF  24 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADPA7005AEHZ-R7 数据表(HTML) 1 Page - Analog Devices

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Data Sheet
ADPA7005
18 GHz to 44 GHz, GaAs, pHEMT, 32 dBm (>1 W), MMIC Power Amplifier
Rev. A
DOCUMENT FEEDBACK
TECHNICAL SUPPORT
Information furnished by Analog Devices is believed to be accurate and reliable "as is". However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to
change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
FEATURES
Output P1dB: up to 31 dBm typical
PSAT: up to 32 dBm typical
Gain: up to 15.5 dB typical
Output IP3: up to 42.5 dBm typical
Supply voltage: 5 V at 1400 mA
50 Ω matched input and output
18-terminal, 7 mm × 7 mm LCC_HS package
Integrated power detector
APPLICATIONS
Military and space
Test instrumentation
Communications
GENERAL DESCRIPTION
The ADPA7005 is a gallium arsenide (GaAs), pseudomorphic high
electron mobility transfer (pHEMT), monolithic microwave integrat-
ed circuit (MMIC), 32 dBm saturated output power (PSAT), >1 W,
power amplifier, with an integrated temperature compensated, on-
chip power detector that operates between 18 GHz and 44 GHz.
The ADPA7005 provides 15.5 dB of small signal gain and approxi-
mately 32 dBm of PSAT at 32 GHz from a 5 V supply
(see Figure 26). The ADPA7005 has an output IP3 of 40 dBm
between 24 GHz to 34 GHz and is ideal for linear applications such
as electronic countermeasure and instrumentation applications re-
quiring >30 dBm of efficient PSAT. The RF input and outputs are
internally matched and dc blocked for ease of integration into
higher level assemblies. The ADPA7005 is packaged in a 7 mm
× 7 mm, 18‑terminal ceramic leadless chip carrier with heat sink
(LCC_HS) that exhibits low thermal resistance and is compatible
with surface-mount manufacturing techniques.
FUNCTIONAL BLOCK DIAGRAM
Figure 1.


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