WILCS02 datasheet(54/71 Pages) MICROCHIP

54 / 71 page

WILCS02IC and WILCS02 Family

Packaging Information

Data Sheet

DS70005557C - 54

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Center Pad Width

Contact Pad Spacing

Center Pad Length

Contact Pitch

5.40

MILLIMETERS

0.50 BSC

MIN

MAX

6.90

Contact Pad Length (X48)

Contact Pad Width (X48)

0.85

0.30

NOM

Contact Pad Spacing

6.90

Contact Pad to Contact Pad (X44)

0.20

Thermal Via Diameter

Thermal Via Pitch

0.33

1.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Contact Pad to Center Pad (X48)

0.33

ØV

SILK SCREEN

48-Lead Very Thin Plastic Quad Flat, No Lead Package (ZZX) - 7x7 mm Body [VQFN]

With 5.3 mm Exposed Pad

Microchip Technology Drawing C04-2535 Rev A

WILCS02 数据表(PDF) 54 Page - Microchip Technology

WILCS02 数据表(HTML) 54 Page - Microchip Technology

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