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MPC7447 数据表(PDF) 47 Page - Freescale Semiconductor, Inc |
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MPC7447 数据表(HTML) 47 Page - Freescale Semiconductor, Inc |
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47 / 60 page ![]() MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4 Freescale Semiconductor 47 System Design Information Figure 23. LGA Package Exploded Cross-Sectional View with Several Heat Sink Options There are several commercially-available heat sinks for the MPC7448 provided by the following vendors: Aavid Thermalloy 603-224-9988 80 Commercial St. Concord, NH 03301 Internet: www.aavidthermalloy.com Alpha Novatech 408-567-8082 473 Sapena Ct. #12 Santa Clara, CA 95054 Internet: www.alphanovatech.com Calgreg Thermal Solutions 888-732-6100 60 Alhambra Road, Suite 1 Warwick, RI 02886 Internet: www.calgregthermalsolutions.com International Electronic Research Corporation (IERC) 818-842-7277 413 North Moss St. Burbank, CA 91502 Internet: www.ctscorp.com Tyco Electronics 800-522-6752 Chip Coolers™ P.O. Box 3668 Harrisburg, PA 17105-3668 Internet: www.tycoelectronics.com Wakefield Engineering 603-635-2800 33 Bridge St. Pelham, NH 03076 Internet: www.wakefield.com Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Thermal Heat Sink HCTE LGA Package Heat Sink Clip Printed-Circuit Board Interface Material |
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