MPC7447 datasheet(56/60 Pages) FREESCALE

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MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4

Freescale Semiconductor

Document Revision History

Table 6: Added separate input leakage specification for BVSEL0, LSSD_MODE, TCK, TDI, TMS, TRST

signals to correctly indicate leakage current for signals with internal pull-up resistors.

Section 5.1: Added paragraph preceding Table 7 and edited notes in Table 7 to clarify core frequencies at

which power consumption is measured.

Section 5.3: Removed voltage derating specifications; this feature has been made redundant by new

device offerings and is no longer supported.

Changed names of “Typical–Nominal” and “Typical–Thermal” power consumption parameters to “Typical”

and “Thermal”, respectively. (Name change only–no specifications were changed.)

Table 11: Revised Notes 16, 18, and 19 to reflect current recommendations for connection of SENSE pins.

Section 9.3: Added paragraph explaining connection recommendations for SENSE pins. (See also Table

11 entry above.)

Table 19: Updated table to reflect changes in specifications for MC7448xxnnnnNC devices.

Table 9: Changed all instances of TT[0:3] to TT[0:4]

Removed mention of these input signals from output valid times and output hold times:

• AACK, CKSTP_IN, DT[0:3]

Figure 17: Modified diagram slightly to correctly show constraint on SYSCLK ramping is related to VDD

voltage, not AVDD voltage. (Diagram clarification only; no change in power sequencing requirements.)

Added Table 20 to reflect introduction of extended temperature devices and associated hardware

specification addendum.

Added 1600 MHz, 1420 MHz, and 1000 MHz devices

Section 4: corrected die size

Table 2: Revised Note 4 to consider overshoot/undershoot and combined with Note 5.

Table 4: Revised operating voltage for 1700 MHz device from ± 50 mV to +20 mV / –50 mV.

Table 7: Updated and expanded table to include Typical – Nominal power consumption.

Table 11: Added voltage derating information for 1700 MHz devices; this feature is not supported at this

time for other speed grades.

Added transient specifications for VDD power supply in Section 9.2.3, added Table 15 and Figure 19 and

renumbered subsequent tables and figures.

Moved Decoupling Recommendations from Section 9.4 to Section 9.2.4 and renumbered subsequent

sections.

Section 9.2.1: Revised power sequencing requirements.

Section 9.7.4: Added thermal diode ideality factor information (previously TBD).

Table 17: Expanded table to show HID1 register values when DFS modes are enabled.

Section 11.2: updated to include additional N-spec device speed grades

Tables 18 and 19: corrected PVR values and added “MC” product code prefix

Initial public release.

Table 17. Document Revision History (continued)

Revision

Date

Substantive Change(s)

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