3/25

L9230

ABSOLUTE MAXIMUM RATINGS

The integrated circuit must not be destroyed by use at the limit values.

Each limit value can be used, as long as no other limit is violated.

Voltage reference point:

All values are, if not otherwise stated, relative to ground.

Direction of current flow:

Current flow into a pin is positive.

Rise-, fall- and delaytimes:

If not otherwise stated, all rise times are between 10% and 90%, fall times

between 90% and 10% and delay times at 50% of the relevant steps.

THERMAL DATA

Symbol

Parameter

Test Condition

Min.

Typ.

Max.

Unit

Supply voltage

static destruction proof

-1

40

V

dynamic destruction proof t <0.5s

(single pulse, Tj < 85°C)

-2

40

V

Logic inputs

IN1, IN2, DI, EN, SS, SI, SCK,DMS

-0.5

7

V

Logic inputs

IN1, IN2, DI, EN, SS, SI, SCK,DMS

-20

mA

Logic outputs SF, SO

R

≥ 10kΩ

-0.5

7

V

Symbol

Parameter

Test Condition

Min.

Typ.

Max.

Unit

Junction temperature

dynamic t < 1 s

-40

+150

+175

°C

°C

Storage temperature

-55

+125

°C

Ambient temperature

-40

+125

°C

Thermal resistance junction to

3

°C/W

Thermal Shutdown Junction

Temperature Threshold

165

175

°C

Symbol

Parameter

Test Condition

Min.

Typ.

Max.

Unit

Power Supply

Supply Voltage

Static Condition

5

28

V

Dynamic Condition (t < 500ms)

40

V

Undervoltage Shutdown

4.7

5

V

Switch OFF voltage

4.5

5

V

Switch ON voltage

4.7

5

V

Hysteresis

200

mV

Supply current

13

30

mA

mA

Note:

1. For supply voltages down to 2.5V the output stages are in tristate condition and the status flag is set to low. Below 2.5V the

device operates in undefined condition

2. Guaranteed by design and package characterization