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STB50NF25 数据表(PDF) 3 Page - STMicroelectronics |
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STB50NF25 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 14 page ![]() STB50NF25 - STP50NF25 Electrical ratings 3/14 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage 250 V VGS Gate-source voltage ±20 V ID (1) 1. Value limited by wire bonding Drain current (continuous) at TC = 25 °C 45 A ID (1) Drain current (continuous) at TC = 100 °C 28 A IDM (2) 2. Pulse width limited by safe operating area Drain current (pulsed) 180 A PTOT Total dissipation at TC = 25 °C 160 W Derating factor 1.28 W/°C dv/dt (3) 3. ISD ≤ 45 A, di/dt ≤ 200 A/µs, VDD = 80% V(BR)DSS Peak diode recovery voltage slope 10 V/ns Tj Tstg Operating junction temperature Storage temperature -55 to 150 °C Table 3. Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case max 0.78 °C/W Rthj-amb Thermal resistance junction-amb max 62.5 °C/W Tl Maximum lead temperature for soldering purpose 300 °C Table 4. Avalanche data Symbol Parameter Value Unit IAR (1) 1. Pulse width limited by Tjmax Avalanche current, repetitive or not-repetitive 32 A EAS (2) 2. Starting TJ= 25 °C, ID = IAR, VDD = 50 V Single pulse avalanche energy 160 mJ |
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