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STB50NF25 数据表(PDF) 4 Page - STMicroelectronics |
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STB50NF25 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 14 page ![]() Electrical characteristics STB50NF25 - STP50NF25 4/14 2 Electrical characteristics (TCASE=25°C unless otherwise specified) Table 5. On/off states Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)DSS Drain-source breakdown voltage ID = 1 mA, VGS= 0 250 V IDSS Zero gate voltage drain current (VGS = 0) VDS = Max rating, VDS = Max rating @125 °C 1 10 µA µA IGSS Gate body leakage current (VDS = 0) VGS = ±20 V ± 100 nA VGS(th) Gate threshold voltage VDS= VGS, ID = 250 µA 2 3 4 V RDS(on) Static drain-source on resistance VGS= 10 V, ID= 22 A 0.055 0.069 Ω Table 6. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit gfs (1) 1. Pulsed: pulse duration=300µs, duty cycle 1.5% Forward transconductance VDS =10 V, ID = 22 A 20 S Ciss Coss Crss Input capacitance Output capacitance Reverse transfer capacitance VDS =25 V, f=1 MHz, VGS=0 2670 465 70.5 pF pF pF Qg Qgs Qgd Total gate charge Gate-source charge Gate-drain charge VDD=200 V, ID = 45 A VGS =10 V (see Figure 14) 68.2 12.2 33.4 nC nC nC RG Gate input resistance f=1 MHz Gate Bias, Bias=0 Test signal level=20 mV open drain 1.1 Ω |
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