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ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS

SN75DP129

SLAS583A – JANUARY 2008 – REVISED MARCH 2008

SIGNAL

LEVEL

STATE

DESCRIPTION

H

Normal Mode

Normal operational mode for device

LP

Device is forced into a Low Power state causing the outputs to go to a high impedance

L

Low Power Mode

state. All other inputs are ignored.

H

HDMI

HDMI-compliant.

L

DVI

DVI-compliant.

Compliant Voltage

4.65 k

Ω

Driver output voltage swing precision control to aid with system compliance.

Swing

(1)

(H) Logic High; (L) Logic Low

PART NUMBER

PART MARKING

PACKAGE

SN75DP129RHHR

DP129

36-pin QFN Reel (large)

SN75DP129RHHT

DP129

36-pin QFN Reel (small)

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

VCC

–0.3 to 3.6

V

Supply voltage range

VDD

–0.3 to 3.6

V

Main link I/O (ML_IN x, DP_SINK x) differential voltage

1.5

V

TMDS I/O

–0.3 to 4

V

Voltage range

HPD I/O

–0.3 to 5.5

V

Auxiliary I/O

–0.3 to 5.5

V

Control I/O

–0.3 to 5.5

V

±12000

V

Electrostatic discharge

±1000

V

±200

V

Continuous power dissipation

See Dissipation Ratings Table

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions

is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to network ground terminal.

(3)

Tested in accordance with JEDEC Standard 22, Test Method A114-B

(4)

Tested in accordance with JEDEC Standard 22, Test Method C101-A

(5)

Tested in accordance with JEDEC Standard 22, Test Method A115-A

PCB JEDEC

PACKAGE

STANDARD

POWER RATING

Low-K

1398 mW

13.98 mW/

°C

559 mW

36-pin QFN (RHH)

High-K

2941 mW

29.41 mW/

°C

1176 mW

(1)

This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.

Copyright © 2008, Texas Instruments Incorporated

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