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STR710FZ1 数据表(PDF) 71 Page - STMicroelectronics |
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STR710FZ1 数据表(HTML) 71 Page - STMicroelectronics |
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71 / 78 page ![]() STR71xF Package characteristics 71/78 Figure 42. 64-Low profile fine pitch ball grid array package Figure 43. 144-low profile fine pitch ball grid array package Figure 44. Recommended PCB design rules (0.80/0.75mm pitch BGA) Dim. mm inches Min Typ Max Min Typ Max A 1.210 1.700 0.048 0.067 A1 0.270 0.011 A2 1.120 0.044 b 0.450 0.500 0.550 0.018 0.020 0.022 D 7.750 8.000 8.150 0.305 0.315 0.321 D1 5.600 0.220 E 7.750 8.000 8.150 0.305 0.315 0.321 E1 5.600 0.220 e 0.720 0.800 0.880 0.028 0.031 0.035 f 1.050 1.200 1.350 0.041 0.047 0.053 ddd 0.120 0.005 Number of Pins N 64 Dim. mm inches1) Min Typ Max Min Typ Ma A 1.21 1.70 0.0476 0.06 A1 0.21 0.0083 A2 1.085 0.0427 b 0.35 0.40 0.45 0.0138 0.0157 0.01 D 9.85 10.00 10.15 0.3878 0.3937 0.39 D1 8.80 0.3465 E 9.85 10.00 10.15 0.3878 0.3937 0.39 E1 8.80 0.3465 e 0.80 0.0315 F 0.60 0.0236 ddd 0.10 0.00 eee 0.15 0.00 fff 0.08 0.00 Number of Pins N 144 1Values in inches are converted from mm and rounded to 4 decimal digits. Dpad Dsm Dpad 0.37 mm Dsm 0.52 mm typ. (depends on solder mask registration tolerance Solder paste 0.37 mm aperture diameter – Non solder mask defined pads are recommended – 4 to 6 mils screen print |
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