TS4984FC datasheet(29/30 Pages) STMICROELECTRONICS

部件名	TS4984FC

功能描述	1.2W Stereo Audio Power Amplifier with Active Low Standby Mode

PDF	30 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

29 / 30 page

TS4984FC

Package Mechanical Data

29/30

Figure 74. Package mechanical data for 15-bump flip-chip

Figure 75. Tape & Reel specification (top view)

■ Die size: 2.40 x 1.90 mm ±30µm

■ Die height (including bumps): 600µm

■ Back Coating height (optional):

60µm±10µm

■ Bump Diameter: 315µm ±50µm

■ Bump Diameter Before Reflow:

300µm ±10µm

■ Bump Height: 250µm ±40µm

■ Die Height: 350µm ±20µm

■ Pitch: 500µm ±50µm

■ Coplanarity: 60µm max.

2.40 mm

1.90 mm

0.86mm

0.25m

∅ 0.3mm

0.5mm

2.40 mm

1.90 mm

0.86mm

0.25m

∅ 0.3mm

0.5mm

600 µm

60 µm Back coating

* Optional

600 µm

60 µm Back coating

* Optional

User direction of feed

Die size X + 70µm

1.5

All dimensions are in mm

User direction of feed

Die size X + 70µm

1.5

All dimensions are in mm

TS4984FC 数据表(PDF) 29 Page - STMicroelectronics

TS4984FC 数据表(HTML) 29 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

数据表下载