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M59MR032C 数据表(PDF) 44 Page - STMicroelectronics |
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M59MR032C 数据表(HTML) 44 Page - STMicroelectronics |
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44 / 49 page ![]() M59MR032C, M59MR032D 44/49 Table 36. Ordering Information Scheme Devices are shipped from the factory with the memory content bits erased to ’1’. Table 37. Daisy Chain Ordering Scheme For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de- vice, please contact the STMicroelectronics Sales Office nearest to you. Example: M59MR032C 100 GC 6 T Device Type M59 Architecture M = Multiplexed Address/Data, Dual Bank, Burst Mode Operating Voltage R = 1.8V Device Function 032C = 32 Mbit (x16), Dual Bank: 1/4-3/4 partitioning, Top Boot 032D = 32 Mbit (x16), Dual Bank: 1/4-3/4 partitioning, Bottom Boot Speed 100 = 100 ns 120 = 120 ns Package ZC = LFBGA54: 0.5 mm pitch GC = µBGA46: 0.5 mm pitch Temperature Range 6 = –40 to 85°C Option T = Tape & Reel packing Example: M59MR032 -GC T Device Type M59MR032 Daisy Chain -GC = µBGA46: 0.5 mm pitch Option T = Tape & Reel Packing |
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