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ST72681/R21 数据表(PDF) 29 Page - STMicroelectronics |
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ST72681/R21 数据表(HTML) 29 Page - STMicroelectronics |
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29 / 32 page ![]() ST72681 Package mechanical data 29/32 8 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 21. 48-pin low profile quad flat package outline Table 27. 48-pin low profile quad flat package dimensions Dim. mm inches(1) 1. Values in inches are converted from mm and rounded to 3 decimal digits. Min. Typ. Max. Min. Typ. Max. A 1.60 0.063 A1 0.05 0.15 0.002 0.006 A2 1.35 1.40 1.45 0.053 0.055 0.057 b 0.17 0.22 0.27 0.007 0.009 0.011 C 0.09 0.20 0.004 0.008 D 9.00 0.354 D1 7.00 0.276 E 9.00 0.354 E1 7.00 0.276 e 0.50 0.020 θ 0° 3.5° 7° 0° 3.5° 7° L 0.45 0.60 0.75 0.018 0.024 0.030 L1 1.00 0.039 Number of Pins N 48 E E1 D D1 L1 L θ c e b A1 A2 A |
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