S2-LPS datasheet(63/73 Pages) STMICROELECTRONICS

部件名	S2-LPS

功能描述	Ultra-low power, high performance, sub-1 GHz transceiver

PDF	73 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

63 / 73 page

Table 51. QFN24L (4x4 mm) package mechanical data

Dim.

Min.

Typ.

Max.

0.95

1.00

1.05

0.02

0.05

0.65

1.00

0.20

0.18

0.25

0.30

3.85

4.00

4.15

2.60

2.70

2.80

3.85

4.00

4.15

2.60

2.70

2.80

0.50

0.35

0.40

0.45

ddd

0.08

9.2

PCB pad pattern

In order to design a proper pad pattern, tolerance analysis is required on package and motherboard dimensions.

The tolerance analysis requires consideration of component tolerances, PCB tolerances and the accuracy of the

equipment used to place the component.

For the pad dimensioning three different minimum values have been considered:

•

Minimum toe fillet = JTmin = 0.1 mm

•

Minimum heel fillet = JHmin = 0.05 mm

•

Minimum side fillet = JSmin = 0 mm

The PCB thermal pad should at least match the exposed die paddle size. The solder mask opening should be

120 to 150 microns larger than the pad size resulting in 60 to 75 microns clearance between the copper pas and

solder mask.

S2-LPS

PCB pad pattern

DS13831 - Rev 1

page 63/73

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