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S2-LPS 数据表(PDF) 64 Page - STMicroelectronics |
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S2-LPS 数据表(HTML) 64 Page - STMicroelectronics |
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64 / 73 page ![]() Figure 17. QFN24 4x4x1pitch 0.5 mm PCB pad pattern Table 52. Exposed pad dimension D2 (mm) E2 (mm) 2.70 2.70 9.3 QFN recommended profile parameters The temperature profile is the most important control in the re-flow soldering and it must be fine tuned to establish a robust process. QFN recommended soldering profile for lead-free mounting is shown in the following table and picture. Figure 18. QFN recommended soldering profiles 20 70 120 170 220 270 0 30 60 90 120 150 180 210 240 270 300 Time [s] 60 ± 15 s 240± 5 °C 0.9 ± 0.1 ° C/s (RtS) 2.0 ± 0.1 °C/s (RSS) 2.0 ±1.0 °C/s - 3.0 ± 2.0 °C/s S2-LPS QFN recommended profile parameters DS13831 - Rev 1 page 64/73 |
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