ST72E311 datasheet(86/100 Pages) STMICROELECTRONICS

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ST72E311 ST72T311

6 ELECTRICAL CHARACTERISTICS

6.1 ABSOLUTE MAXIMUM RATINGS

This product contains devices to protect the inputs

against damage due to high static voltages, how-

ever it is advisable to take normal precaution to

avoid application of any voltage higher than the

specified maximum rated voltages.

For proper operation it is recommended that VI

and VO be higher than VSS and lower than VDD.

Reliability is enhanced if unused inputs are con-

nected to an appropriate logic voltage level (VDD

or VSS).

Power Considerations.The average chip-junc-

tion temperature, TJ, in Celsius can be obtained

from:

TJ=

TA + PD x RthJA

Where: TA =

Ambient Temperature.

RthJA = Package thermal resistance

(junction-to ambient).

PD =PINT +PPORT.

PINT =IDD xVDD (chip internal power).

PPORT =Port power dissipation

determined by the user)

Note: Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at these conditions is not implied. Exposure to maximum

rating conditions for extended periods may affect device reliability.

Symbol

Parameter

Value

Unit

VDD

Digital Supply Voltage

-0.3 to 6.0

VDDA

Analog Supply and Reference Voltage

VDD - 0.3 to VDD + 0.3

Input Voltage

VSS - 0.3 to VDD + 0.3

VAI

Analog Input Voltage (A/D Converter)

VSS - 0.3 to VDD + 0.3

VSSA-0.3 to VDDA+0.3

Output Voltage

VSS - 0.3 to VDD + 0.3

IVDD

Total Current into VDD (source)

100

IVSS

Total Current out of VSS (sink)

100

Junction Temperature

150

°C

TSTG

Storage Temperature

-60 to 150

°C

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