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TAS5701PAP 数据表(PDF) 20 Page - Texas Instruments

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部件名 TAS5701PAP
功能描述  20-W STEREO DIGITAL AUDIO POWER AMPLIFIER
PDF  26 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

TAS5701PAP 数据表(HTML) 20 Page - Texas Instruments

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Gain Control
DEVICE PROTECTION SYSTEM
Short-Circuit Protection
Overtemperature Protection
Undervoltage Protection (UVP) and Power-On Reset (POR)
TAS5701
SLOS559 – JUNE 2008 ...................................................................................................................................................................................................... www.ti.com
The gain of the DAP is selected via two external gain pins (GAIN_0 and GAIN_1). Table 2 lists the corresponding
channel gain (for ALL channels) for GAIN_0 and GAIN_1 settings. Individual channel gain is not possible.
Changes to the GAIN_x terminals are latched in immediately on a rising edge of RESET. Changes to the
GAIN_x terminals while RESET is high are not allowed.
Table 2. Gain Control
GAIN_1
GAIN_0
CHANNEL GAIN (dB)
0
0
0
0
1
6
1
0
12
1
1
18
The TAS5701 contains advanced protection circuitry carefully designed to facilitate system integration and ease
of use, as well as to safeguard the device from permanent failure due to a wide range of fault conditions such as
short circuits, overtemperature, and undervoltage. The TAS5701 responds to a fault by immediately setting the
power stage in a high-impedance (Hi-Z) state and reporting the error on the FAULT pin (FAULT = 0); the device
automatically recovers when the fault condition has been removed.
The device has independent, fast-reacting current detectors on all high-side and low-side power-stage FETs. The
detector outputs are closely monitored by a protection system. If a high-current condition situation exists, i.e., the
power stage outputs are shorted, the protection system triggers a latching shutdown, resulting in the power stage
being set in the high-impedance (Hi-Z) state and FAULT going low. Overcurrent protection is not independent for
half-bridges A and B and, respectively, C and D. That is, if the bridge-tied load between half-bridges A and B
causes an overcurrent fault, half-bridges A, B, C, and D are shut down.
If the device junction temperature exceeds 150°C (nominal), the device is put into thermal shutdown, resulting in
all half-bridge outputs being set in the high-impedance (Hi-Z) state and FAULT going low. Once the temperature
decreases 30°C (typical), the device resumes normal operation.
The UVP and POR circuits of the TAS5701 fully protect the device in any power-up/down and brownout situation.
While powering up, the POR circuit resets the protection circuitry and ensures that all circuits are fully operational
when the VDD and GVDD_X supply voltages reach 9.6 V (typical). Although GVDD_x and VDD pins are
independently monitored, a supply voltage drop below the UVP threshold on any VDD or GVDD_x pin results in
all outputs immediately being set in the high-impedence (Hi-Z) state and FAULT pin being asserted low. The
device automatically resumes operation when all supply voltages have increased above the UVP threshold.
20
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5701



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