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STE2002DIE2 数据表(PDF) 49 Page - STMicroelectronics |
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STE2002DIE2 数据表(HTML) 49 Page - STMicroelectronics |
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49 / 51 page ![]() 49/51 STE2002 Figure 53. Alignment marks coordinates Figure 54. Alignment marks dimensions Table 17. Bumps Table 18. Die Mechanical Dimensions R11 311 -3571.5 -275.0 R10 312 -3571.5 -325.0 R9 313 -3571.5 -375.0 R8 314 -3571.5 -425.0 R7 315 -3571.5 -475.0 R6 316 -3571.5 -525.0 R5 317 -3571.5 -575.0 R4 318 -3571.5 -625.0 R3 319 -3571.5 -675.0 R2 320 -3571.5 -725.0 R1 321 -3571.5 -775.0 R0 322 -3571.5 -825.0 ICON 323 -3571.5 -875.0 X Y MARKS -3574.5 -949.5 mark1 +3574.5 -949.5 mark2 -2250 +949.5 mark3 +1200 +949.5 mark4 Table 16. Pad Coordinates (continued) NAME PAD X ( µm) Y( µm) Bump Number Dimensions Bumps on Single Row Size 1-187 212-235 256-260 283-323 30 µm X 98 µm X 17.5 Bumps on Two Rows Size 188-211 236-255 261-282 30 µm X 87 µm X 17.5 Pad Size 1-323 43 µm X 107µm Pad Pitch 1-323 50 µm Spacing between Bumps 1-323 20 µm Die Size 2.07mm x 7.32mm Wafers Thickness 500 µm 94 µm 39 µm |
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