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STM2DPFS30L 数据表(PDF) 2 Page - STMicroelectronics |
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STM2DPFS30L 数据表(HTML) 2 Page - STMicroelectronics |
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2 / 6 page ![]() THERMAL DATA Rthj-amb Tstg T j (*) Thermal Resistance Junction-ambient MOSFET Storage Temperature Range Maximum Junction Temperat ure 100 -65 to 150 150 oC/W o C o C (*) Mounted on a 1 in 2 pad of 2oz Cu in FR-4 board MOSFET ELECTRICAL CHARACTERISTICS (Tcase =25 oC unless otherwise specified) OFF Symbo l Parameter Test Con ditions Min. Typ. Max. Unit V(BR)DSS Drain-source Breakdown Voltage ID =250 µAVGS =0 30 V IDSS Zero Gat e Volt age Drain Current (VGS =0) VDS =Max Rating VDS =Max Rating Tc = 125 oC 1 10 µA µA IGSS Gat e-body Leakage Current (VDS =0) VGS = ± 20 V ± 100 nA ON ( ∗) Symbo l Parameter Test Con ditions Min. Typ. Max. Unit VGS(th) Gat e Threshold Voltage VDS =VGS ID = 250 µA1 1.7 2. 5 V RDS(on) Static Drain-source On Resistance VGS =10V ID =1 A VGS =4.5V ID =1 A 0.145 0.18 0.165 0. 2 Ω ID(o n) On State Drain Current VDS >ID(o n) xRDS(on )max VGS =10 V 2A DYNAMIC Symbo l Parameter Test Con ditions Min. Typ. Max. Unit gfs ( ∗)Forward Transconductance VDS >ID(o n) xRDS(on )max ID =1 A 2 S Ciss Coss Crss Input Capacitance Out put Capacitance Reverse T ransf er Capacitance VDS = 25V f = 1MHz VGS = 0 510 170 55 660 220 72 pF pF pF STM2DPFS30L 2/6 |
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