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LIS331DL 数据表(PDF) 40 Page - STMicroelectronics |
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LIS331DL 数据表(HTML) 40 Page - STMicroelectronics |
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40 / 42 page ![]() Package information LIS331DL 40/42 9 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK® is an ST trademark. ECOPACK® specifications are available at: www.st.com. Figure 25. LGA 16: Mechanical data and package dimensions Dimensions Ref. mm inch Min. Typ. Max. Min. Typ. Max. A1 1.000 0.0394 A2 0.7850.0309 A3 0.200 0.0079 D1 2.850 3.000 3.150 0.1122 0.1181 0.1240 E1 2.850 3.000 3.150 0.1122 0.1181 0.1240 L1 1.000 1.060 0.0394 0.0417 L2 2.000 2.060 0.07870.0811 N1 0.500 0.0197 N2 1.000 0.0394 M 0.040 0.100 0.160 0.0016 0.0039 0.0063 P1 0.875 0.0344 P2 1.275 0.0502 T1 0.2900.350 0.410 0.0114 0.0138 0.0161 T2 0.190 0.250 0.310 0.0075 0.0098 0.0122 d 0.150 0.0059 k 0.050 0.0020 LGA16 (3x3x1.0mm) Land Grid Array Package Outline and 7983231 mechanical data |
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