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STPC0380BTI3 数据表(PDF) 41 Page - STMicroelectronics |
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STPC0380BTI3 数据表(HTML) 41 Page - STMicroelectronics |
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41 / 51 page  MECHANICAL DATA 41/51 Issue 1.2 Figure 5-6. Thermal dissipation with heatsink Board Ambient Case Junction Board Ambient Ambient Case Junction Board Rca Rjc Rjb Rba 36 50 8.5 Rja = 9.5 °C/W Airflow = 0 Board dimensions: The PBGA is centered on board Copper thickness: -17 µm for internal layers -34 µm for external layers - 10.2 cm x 12.7 cm - 4 layers (2 for signals, 1 GND, 1VCC) There are no other devices Heat sink is 11.1 °C/W 1 via pad per ground ball (8-mil wire) 40% copper on signal layers Board temperature taken at the center balls |
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