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LED7707TR 数据表(PDF) 30 Page - STMicroelectronics |
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LED7707TR 数据表(HTML) 30 Page - STMicroelectronics |
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30 / 48 page ![]() Application information LED7707 30/48 Equation 22 where nROWs is the number of active rows, ΔVf,LEDs is the spread of the LEDs forward voltage and nLEDs is the number of LEDs per row. d) LDO losses, due to the dissipation of the 5 V linear regulator: Equation 23 The LED7707 is housed in a 24 leads 4x4-VFQFPN package with exposed pad that allows good thermal performance. However it is also important to design properly the demonstration board layout in order to assure correct heat dissipation. Figure 20 shows a picture of the LED7707 application demonstration board taken using an infrared camera. The chip temperature, in those application conditions, is kept below 50 °C. Figure 20. Demonstration board thermographic analysis ( ) ( ) DIM LEDs LEDs , f IFB ROWs ROW GEN D n V V 1 n I P ⋅ ⋅ Δ + ⋅ − ⋅ = ( ) LDO LDO IN LDO , D I V V P ⋅ − = 64°C 50°C VIN = 12V IROW = 60mA VOUT = 30V FSW = 660kHz DDIM = 100% Tamb = 25°C 64°C 50°C VIN = 12V IROW = 60mA VOUT = 30V FSW = 660kHz DDIM = 100% Tamb = 25°C |
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