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TDA7502 数据表(PDF) 2 Page - STMicroelectronics |
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TDA7502 数据表(HTML) 2 Page - STMicroelectronics |
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2 / 8 page ![]() THERMAL DATA Symbol Parameter Value Unit Rth j-amb Thermal Resistance Junction to Ambient 50 °C/W SCKR LRCKR SDO2 SDO1 SDO0 SCKT LRCKT VDD4 GND4 DBOUT VDD2 VDD1 DBRQN TESTEN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 INT SCANEN GND2 DBCK GND1 DBIN VDD5 GND5 PIN CONNECTION ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit VDDC Core DC Supply voltage 4.6 V VDDP Pads DC Supply voltage 4.6 V VI,VIN Digital or analog input voltage -0.5 to (VDDP +0.5) V Top Operative temperature range -40 to 85 °C Tstg Storage temperature range (plastic) -55 to 150 °C PIN DESCRIPTION N. Name Type Reset Status (1) Function 1 VDD1 I – 3.3V core supply. 2 GND1 I – Core ground. 3 INT I/O – External interrupt line (Input/Output). When this line is asserted low, the DSP may be interrupted. Acts as IRQA line of DSP core. 4 SCANEN I – SCAN Enable When active with TESTEN also active, controls the shifting of the internal scan chains. 5 TESTEN I – Test Enable. When active, puts the chip into test mode and muxes the XTI clock to all flip-flops. When SCANEN is also active, the scan chain shifting 6 DBRQN I – Debug Port Request Input. Means of entering the Debug mode of operation. TDA7502 2/8 |
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