TMX320C6747ZKB3 datasheet(6/203 Pages) TI

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Contents

TMS320C6745/6747 Floating-point Digital Signal Processor

SPRS377B – SEPTEMBER 2008 – REVISED DECEMBER 2008

www.ti.com

TMS320C6745/6747 Floating-point Digital Signal

Behavior

............................................. 60

Processor

................................................. 1

6.3

Power Supplies

...................................... 61

1.1

Features

.............................................. 1

6.4

Reset

................................................ 61

1.2

Trademarks

........................................... 3

6.5

Crystal Oscillator or External Clock Input

........... 64

1.3

Description

............................................ 4

6.6

Clock PLLs

.......................................... 65

1.4

Functional Block Diagram

............................ 5

6.7

Interrupts

............................................ 68

Revision History

......................................... 7

6.8

General-Purpose Input/Output (GPIO)

.............. 74

Device Overview

......................................... 8

6.9

EDMA

............................................... 77

3.1

Device Characteristics

................................ 8

6.10

External Memory Interface A (EMIFA)

.............. 82

3.2

Device Compatibility

.................................. 9

6.11

External Memory Interface B (EMIFB)

.............. 92

3.3

DSP Subsystem

..................................... 10

6.12

MMC / SD / SDIO (MMCSD)

........................ 97

3.4

Memory Map Summary

............................. 16

6.13

Ethernet Media Access Controller (EMAC)

........ 100

3.5

Pin Assignments

.................................... 19

6.14

Management Data Input/Output (MDIO)

........... 106

3.6

Terminal Functions

.................................. 21

6.15

Multichannel Audio Serial Ports (McASP0, McASP1,

and McASP2)

...................................... 108

Device Configuration

.................................. 38

6.16

Serial Peripheral Interface Ports (SPI0, SPI1)

..... 124

4.1

Introduction

.......................................... 38

6.17

Enhanced Capture (eCAP) Peripheral

............. 142

4.2

Boot Modes Supported

.............................. 38

6.18

Enhanced Quadrature Encoder (eQEP)

4.3

SYSCFG Module

.................................... 38

Peripheral

.......................................... 145

4.4

Pin Multiplexing Control Registers

.................. 39

6.19

Enhanced High-Resolution Pulse-Width Modulator

4.5

Bus Master Priority Configuration

................... 41

(eHRPWM)

......................................... 147

4.6

Chip Configuration Registers (CFGCHIP and

6.20

LCD Controller

..................................... 151

SUSPSRC)

.......................................... 45

6.21

Timers

.............................................. 166

4.7

DSP Communication Registers

..................... 52

6.22

Inter-Integrated Circuit Serial Ports (I2C0, I2C1)

.. 168

4.8

Device Support

...................................... 53

6.23

Universal Asynchronous Receiver/Transmitter

4.9

Documentation Support

............................. 54

(UART)

............................................. 172

Device Operating Conditions

........................ 56

6.24

USB1 Host Controller Registers (USB1.1 OHCI)

.. 174

5.1

Absolute Maximum Ratings Over Operating Case

6.25

USB0 OTG (USB2.0 OTG)

........................ 175

Temperature Range

6.26

Host-Port Interface (UHPI)

......................... 183

(Unless Otherwise Noted)

.......................... 56

6.27

Power and Sleep Controller (PSC)

................ 190

5.2

Recommended Operating Conditions

............... 57

5.3

Electrical Characteristics Over Recommended

6.28

Emulation Logic

.................................... 192

Ranges of Supply Voltage and Operating Case

6.29

Real Time Clock (RTC)

............................ 194

Temperature (Unless Otherwise Noted)

............ 58

Mechanical Packaging and Orderable

Peripheral Information and Electrical

Information

............................................. 198

Specifications

........................................... 59

7.1

Thermal Data for ZKB

.............................. 198

6.1

Parameter Information

.............................. 59

7.2

Thermal Data for PTP

.............................. 199

6.2

Recommended Clock and Control Signal Transition

7.3

Mechanical Drawings

.............................. 199

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