LTC4306

19

4306f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

GN Package

24-Lead Plastic SSOP

(Reference LTC DWG # 05-08-1641)

PACKAGE DESCRIPTIO

.337 – .344*

(8.560 – 8.738)

GN24 (SSOP) 0204

12

3

4

5

6

7

8

9 10 11 12

.229 – .244

(5.817 – 6.198)

.150 – .157**

(3.810 – 3.988)

16

17

18

19

20

21

22

23

24

15 1413

.016 – .050

(0.406 – 1.270)

.015

± .004

(0.38

± 0.10)

× 45°

0

° – 8° TYP

.0075 – .0098

(0.19 – 0.25)

.0532 – .0688

(1.35 – 1.75)

.008 – .012

(0.203 – 0.305)

TYP

.004 – .0098

(0.102 – 0.249)

.0250

(0.635)

BSC

.033

(0.838)

REF

.254 MIN

RECOMMENDED SOLDER PAD LAYOUT

.150 – .165

.0250 BSC

.0165

±.0015

.045

±.005

*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

INCHES

(MILLIMETERS)

NOTE:

1. CONTROLLING DIMENSION: INCHES

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

UFD Package

24-Lead Plastic QFN (4mm x 5mm)

(Reference LTC DWG # 05-08-1696)

4.00

± 0.10

(2 SIDES)

2.65

± 0.10

(2 SIDES)

5.00

± 0.10

(2 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40

± 0.05

23 24

1

2

BOTTOM VIEW—EXPOSED PAD

3.65

± 0.10

(2 SIDES)

0.75

± 0.05

R = 0.115

TYP

PIN 1 NOTCH

R = 0.30 TYP

0.25

± 0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UFD24) QFN 0505

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.70

±0.05

0.25

±0.05

0.50 BSC

2.65

± 0.05

(2 SIDES)

3.65

± 0.05

(2 SIDES)

4.10

± 0.05

5.50

± 0.05

3.10

± 0.05

4.50

± 0.05

PACKAGE

OUTLINE