LTM4609

19

4609fa

Table 4. Boost Mode

DERATING CURVE

POWER LOSS CURVE

AIR FLOW (LFM)

HEAT SINK

Figure 7, 9

16, 30

Figure 5

0

None

11.4

Figure 7, 9

16, 30

Figure 5

200

None

8.5

Figure 7, 9

16, 30

Figure 5

400

None

7.5

Figure 8, 10

16, 30

Figure 5

0

BGA Heat Sink

11.0

Figure 8, 10

16, 30

Figure 5

200

BGA Heat Sink

7.9

Figure 8, 10

16, 30

Figure 5

400

BGA Heat Sink

7.1

Table 5. Buck Mode

DERATING CURVE

POWER LOSS CURVE

AIR FLOW (LFM)

HEAT SINK

Figure 11, 13

12, 20

Figure 6

0

None

8.2

Figure 11, 13

12, 20

Figure 6

200

None

5.9

Figure 11, 13

12, 20

Figure 6

400

None

5.4

Figure 12, 14

12, 20

Figure 6

0

BGA Heat Sink

7.5

Figure 12, 14

12, 20

Figure 6

200

BGA Heat Sink

5.3

Figure 12, 14

12, 20

Figure 6

400

BGA Heat Sink

4.8

HEAT SINK MANUFACTURER

PART NUMBER

PHONE NUMBER

Wakefield Engineering

LTN20069

603-635-2800

Aaivd Thermalloy

375424B00034G

603-224-9988

*The results of thermal resistance from junction to ambient

as the junction temperature (which is in the μModule for most cases) and the power losses from all components are counted for calculations. It has to be

mentioned that poor board design may increase the

TYPICAL APPLICATIONS

AMBIENT TEMPERATURE (°C)

0

1

5

6

7

8

25

55

45

35

65

4609 F13

2

4

3

85

75

95 105

AMBIENT TEMPERATURE (°C)

0

1

5

6

7

8

25

55

45

35

65

4609 F14

2

4

3

85

75

95 105

APPLICATIONS INFORMATION