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LTM4609EVPBF 数据表(PDF) 20 Page - Linear Technology

部件名 LTM4609EVPBF
功能描述  36VIN, 34VOUT High Effi ciency Buck-Boost DC/DC 關Module
PDF  24 Pages
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制造商  LINER [Linear Technology]
网页  http://www.linear.com
标志 LINER - Linear Technology

LTM4609EVPBF 数据表(HTML) 20 Page - Linear Technology

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LTM4609
20
4609fa
VOUT
COUT
VIN
RSENSE
RSENSE
PGND
SW1
L1
SW2
PGND
SGND
CIN
4609 F15
KELVIN CONNECTIONS TO RSENSE
+–
APPLICATIONS INFORMATION
Layout Checklist/Example
The high integration of LTM4609 makes the PCB board
layout very simple and easy. However, to optimize its electri-
cal and thermal performance, some layout considerations
are still necessary.
• Use large PCB copper areas for high current path, includ-
ing VIN, RSENSE, SW1, SW2, PGND and VOUT. It helps to
minimize the PCB conduction loss and thermal stress.
• Place high frequency input and output ceramic capaci-
tors next to the VIN, PGND and VOUT pins to minimize
high frequency noise
• RouteSENSE– andSENSE+ leadstogetherwithminimum
PC trace spacing. Avoid sense lines passing through
noisy areas, such as switch nodes.
• Place a dedicated power ground layer underneath the
unit.
• To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between the top layer and other power layers
• Do not put vias directly on pads, unless the vias are
capped.
• Use a separated SGND ground copper area for com-
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
Figure 15. gives a good example of the recommended
layout.
Figure 15. Recommended PCB Layout
VOUT
PGOOD
FCB
RUN
SW1
COMP
SW2
INTVCC
RSENSE
EXTVCC
SENSE–
STBYMD
PLLFLTR
SS
VFB
SGND
PLLIN
LTM4609
R2
9mΩ
L1
4.7μH
RFB
7.15k
R1
1.5k
R3
1k
100μF
25V
4609 TA02
VOUT
12V
10A
CLOCK SYNC
VIN
PGND
VIN
12V TO 36V
C3
0.1μF
10μF
50V
×2
+
ON/OFF
SENSE+
Figure 16. Buck Mode Operation with 12V to 36V Input
TYPICAL APPLICATIONS



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