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AD8120ACPZ-R2 数据表(PDF) 5 Page - Analog Devices |
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AD8120ACPZ-R2 数据表(HTML) 5 Page - Analog Devices |
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5 / 16 page ![]() AD8120 Rev. 0 | Page 5 of 16 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating Supply Voltage ±6 V Internal Power Dissipation 32-Lead LFCSP at TA = 25°C 3.5 W Input Voltage VS− − 0.3 V to VS+ + 0.3 V Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering 10 sec) 300°C Junction Temperature 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, for a device soldered in a circuit board for surface-mount packages. Table 3. Thermal Resistance Package Type θJA θJC Unit 5 mm × 5 mm, 32-Lead LFCSP 36 2 °C/W MAXIMUM POWER DISSIPATION The maximum safe power dissipation in the AD8120 package is limited by its junction temperature. The maximum safe junction temperature for plastic encapsulated devices, as determined by the glass transition temperature of the plastic, is approximately 150°C. Temporarily exceeding this limit may cause a shift in the parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure. The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the package due to the load drive for all outputs. The quiescent power dissipation is the voltage between the supply pins (VS+ and VS−) times the quiescent current (IS). Power dissipated due to load drive depends upon the particular application. It is cal- culated by multiplying the load current by the associated voltage drop across the device. RMS voltages and currents must be used in these calculations. Airflow increases heat dissipation by reducing θJA. To ensure optimal thermal performance, the exposed paddle must be in an optimized thermal connection with an external plane layer. 6 5 4 3 2 1 0 –40 –20 0 20 40 60 80 AMBIENT TEMPERATURE (°C) Figure 2. Maximum Power Dissipation vs. Ambient Temperature on a JEDEC Standard 4-Layer Board ESD CAUTION |
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