AD8120

Rev. 0 | Page 16 of 16

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

12° MAX

1.00

0.85

0.80

SEATING

PLANE

COPLANARITY

0.08

1

32

8

9

25

24

16

17

0.50

0.40

0.30

3.50 REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.65

3.50 SQ

3.35

PIN 1

INDICATOR

0.60 MAX

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 26. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD8120ACPZ-R21

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

CP-32-4

AD8120ACPZ-R71

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

CP-32-4

AD8120ACPZ-RL1

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

CP-32-4

©2009 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D07839-0-7/09(0)